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electron backscatter diffraction ebsd detector  (Gatan Inc)


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    Gatan Inc electron backscatter diffraction ebsd detector
    Electron Backscatter Diffraction Ebsd Detector, supplied by Gatan Inc, used in various techniques. Bioz Stars score: 96/100, based on 710 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
    https://www.bioz.com/product/electron+backscatter+diffraction+ebsd/Velocity/10__1016_slash_j__corsci__2026__114328-120-23-28
    Average 96 stars, based on 710 article reviews
    electron backscatter diffraction ebsd detector - by Bioz Stars, 2026-11
    96/100 stars

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    Article Title: Metallurgical reactions and high-temperature long-term reliability of the Sn-2.3Ag flip-chip solder bump
    Article Snippet: Flip-chip bonding technology has been extensively applied in the semiconductor packaging field given the recent increase in demand for electronic products requiring miniaturization and high performance.. In this study, a hightemperature long-term reliability evaluation was performed to evaluate the metallurgical reaction and mechanical properties at the Sn-2.3Ag (wt%) flip-chip solder bump joints.. Isothermal aging was performed for up to 2000 h at 150 C. A Ni3Sn4 intermetallic compound (IMC) was formed at the interface of the solder joints, and the thickness of the IMC layer increased as the isothermal aging time increased; however, the thickness of Ni under bump metallization (Ni UBM) layer was decreased during the growth of the IMC.

    Article Title: Microstructure evolution and mechanical property of TiCp/Ti6Al4V composites manufactured using laser metal deposition assisted by synchronous ultrasonic impact treatment
    Article Snippet: In this work, synchronous ultrasonic impact treatment (UIT) is proposed to regulate the microstructure and enhance the mechanical property of TiCp/Ti6Al4V composites prepared by laser metal deposition (LMD).. The results showed that the columnar to equiaxed transition (CET) of prior β-Ti was completed under the effect of UIT with a grain size reduction of approximately 47.27 %.. The α-Ti grains were refined and their preferred orientation was significantly weakened.

    Article Title: Effect of Y2O3 content on microstructure and mechanical properties of ODS Ti-6Al-4V alloys fabricated by in situ atomization and SPS
    Article Snippet: Additionally, the microstructures of the sintered compacts were analyzed by electron backscatter diffraction (EBSD) (Velocity Super, EDAX).

    Article Title: Additively manufactured TiNiSn-based half-Heusler compounds enabled by in situ crack healing
    Article Snippet: Thermoelectric (TE) materials are traditionally manufactured by sintering of alloyed powders, followed by cutting the sintered specimen to the desired shape.. This process is time-consuming, wasteful in terms of materials and energy, and costly, ultimately hindering the utilization of TE generators.. Additive manufacturing (AM) offers a potential solution, but the inherently low thermal conductivity and brittleness of TE materials pose challenges for their fabrication via this approach.

    Article Title: Enhanced stress relaxation resistance and strength-electrical conductivity combination of graphene reinforced Cu-0.5La composite wire for high temperature applications
    Article Snippet: The temperature-rise effect caused by the boom of high-power equipment for communications and transportation brings new challenges to the stress relaxation resistance and tensile properties of Cu wires at elevated temperatures.. In order to meet higher property requirements, herein we introduced a graphene reinforced Cu-0.5La alloy (Gr/Cu-0.5La) composite wire prepared by in-situ synthesis and powder metallurgy methods.. Thanks to the distribution of in-situ formed graphene and Gr-La2O3 hybrid reinforcements at the grain boundaries, the mechanical properties of the composite wire were improved.

    Article Title: Directed energy deposition of Fe-5.5Si electrical steel with Ti additions for balanced magnetic and mechanical performance
    Article Snippet: High-silicon electrical steels show excellent soft magnetic properties, but their widespread employment has been limited due to their inherently poor workability.. To overcome this limitation, additive manufacturing methods are being explored.. In this study, high-silicon electrical steels with Ti additions showing improved core loss and yield strength have been fabricated by directed energy deposition.

    Microscopy:

    Article Title: Distribution of Grain Boundary Plane Orientation Texture in Hot Deformed Nd-Fe-B Magnets and Its Texture Enhancement Mechanism
    Article Snippet: This paper reports the successful preparation of hot-deformed (HD) Nd-Fe-B magnets using spark plasma sintering.. The study further explores the orientation texture characteristics of the grain boundary plane distribution in Nd-Fe-B magnets through electron backscatter diffraction and the five parameter analysis (FPA) method.. As an interdisciplinary study, the integration of stereological methods with rare-earth magnet materials provides valuable insights into the fundamental relationship between structure and properties.

    Article Title: Evolution of the Metallographic Structure of Additively Manufactured Ti-6Al-4V and Ti-6Al-7Nb Titanium Alloys
    Article Snippet: .. The crystallographic orientation was investigated using electron backscatter diffraction (EBSD) with a FEI Quanta 3D FEG scanning electron microscope integrated with an EDAX Trident system (Thermo Fisher Scientific, Waltham, MA, USA). ..



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    <t>EBSD</t> analysis of the T6-treated AC alloy: ( a ) grain orientation and size distribution of α-Al grains; ( b ) corresponding PFs; ( c ) GB analysis; ( d ) RF analysis.
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    EBSD analysis of the T6-treated AC alloy: ( a ) grain orientation and size distribution of α-Al grains; ( b ) corresponding PFs; ( c ) GB analysis; ( d ) RF analysis.

    Journal: Materials

    Article Title: Evolution of the Young’s Modulus of Al-7Si-4Cu Alloy with Increasing Temperature by Various Strengthening Approaches

    doi: 10.3390/ma19091831

    Figure Lengend Snippet: EBSD analysis of the T6-treated AC alloy: ( a ) grain orientation and size distribution of α-Al grains; ( b ) corresponding PFs; ( c ) GB analysis; ( d ) RF analysis.

    Article Snippet: Electron backscatter diffraction (EBSD) analysis was performed using a JEOL JSM-7800F SEM (Japan Electron Optics Laboratory Co., Ltd., Tokyo, Japan) to characterize the grain size, crystallographic orientation, grain boundary (GB) distribution, and recrystallized fraction (RF).

    Techniques:

    EBSD analysis of the T6-treated AE alloy: ( a ) grain orientation and size distribution of α-Al grains; ( b ) corresponding PFs; ( c ) GB analysis; ( d ) RF analysis.

    Journal: Materials

    Article Title: Evolution of the Young’s Modulus of Al-7Si-4Cu Alloy with Increasing Temperature by Various Strengthening Approaches

    doi: 10.3390/ma19091831

    Figure Lengend Snippet: EBSD analysis of the T6-treated AE alloy: ( a ) grain orientation and size distribution of α-Al grains; ( b ) corresponding PFs; ( c ) GB analysis; ( d ) RF analysis.

    Article Snippet: Electron backscatter diffraction (EBSD) analysis was performed using a JEOL JSM-7800F SEM (Japan Electron Optics Laboratory Co., Ltd., Tokyo, Japan) to characterize the grain size, crystallographic orientation, grain boundary (GB) distribution, and recrystallized fraction (RF).

    Techniques: